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Level 3 Award in Micro-Soldering & PCB Repair

The PIMS Level 3 Award in Micro-Soldering & PCB Repair develops advanced practical competence in precision soldering, printed-circuit-board diagnostics, component replacement and electronic-device repair.Th...

Training Area HiQual UK
Category Engineering & Manufacturing Industry
Learning Flexible
Provider PIMS
Level 3 Award in Micro-Soldering & PCB Repair program overview 01

Program Overview

The PIMS Level 3 Award in Micro-Soldering & PCB Repair develops advanced practical competence in precision soldering, printed-circuit-board diagnostics, component replacement and electronic-device repair.

The programme focuses on fault finding, IC and connector replacement, trace repair, BGA rework, ESD protection, continuity testing and professional repair-quality verification.

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What You'll Learn

  1. PCB Construction Fundamentals
  2. Micro-Soldering Principles
  3. Soldering Stations and Microscopes
  4. Hot-Air Rework Equipment
  5. ESD Protection
  6. PCB Fault Diagnosis
  7. Short-Circuit Detection
  8. Open-Circuit Detection
  9. Trace Damage Identification
  10. IC Removal and Replacement
  11. Connector Replacement
  12. Micro-Component Replacement
  13. Micro-Jumper Wiring
  14. Pad and Trace Repair
  15. BGA Rework
  16. Reballing Techniques
  17. Thermal Management
  18. Power-Line Repair
  19. Data-Line Repair
  20. Continuity Testing
  21. Functional Testing
  22. Repair Documentation
Level 3 Award in Micro-Soldering & PCB Repair classroom training
Practical Learning Knowledge you can apply

Empowering professionals with knowledge, practical understanding and stronger workplace skills.

PIMS
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Who Should Attend?

Who should attend Level 3 Award in Micro-Soldering & PCB Repair

This PIMS Micro-Soldering & PCB Repair course is suitable for Mobile Phone Repair Technicians, Electronics Repair Technicians, IT Hardware Specialists, Electronics Engineers and Repair-Business Owners.

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Key Benefits

After completing the programme, learners should be better prepared to:

  • Develop precision micro-soldering competence
  • Improve PCB fault-diagnosis skills
  • Strengthen advanced component-replacement techniques
  • Develop BGA and reballing awareness
  • Improve ESD and repair-safety practices
  • Strengthen repair-quality verification and documentation
Level 3 Award in Micro-Soldering & PCB Repair program benefits
Level 3 Award in Micro-Soldering & PCB Repair assessment
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Assessment & Evaluation

  • Assessment Type: Written examination, practical soldering assessment and project.
  • Format: Multiple-choice questions, short answers, micro-soldering tasks and applied project work.
  • Total Questions: 60 theory questions plus 1 practical assessment and 1 project submission.
  • Passing Score: 70%.
  • Duration: 4–5 days (28–32 hours total).
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Contact PIMS for information about Level 3 Award in Micro-Soldering & PCB Repair, training schedules and enrollment.

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